Higher Aspect Ratio TSV Structure ECP Bottom-Up Plating Process
Yinuo Jin & Bo Zheng & Jian Wang & David H. Wang & Qixing Yu
2021 22nd International Conference on Electronic Packaging Technology (ICEPT);2021; ; ;10.1109/ICEPT52650.2021.9567719
الناشر:
IEEE
اللغة:
english
ISBN 10:
1665413913
ISBN 13:
9781665413916
ISBN:
10.1109/ICEPT52650.2021.9567719
ملف:
PDF, 17.08 MB
IPFS:
,
english0